Vienna Ab-initio Simulation Package and Applications 2025

The registration and abstract submission periods for the EuroCC2 conference organized by the HPC Chair are now open.

The “Vienna Ab-initio Simulation Package and Applications 2025” online conference will take place on February 12-13, 2025. 

Organized by the HPC Chair and sponsored by EuroCC2 and the Foundation for Science & Technology (FCT), the event is free to attend and will bring together researchers and experts in computational chemistry and materials science from around the globe. 

The conference will focus on the Vienna Ab-initio Simulation Package (VASP), a leading software for simulating the chemical and physical properties of materials at the atomic level. Over the course of two days, participants will explore advanced topics such as computation efficiencies with VASP on CPUs and GPGPUs, parallelization APIs (MPI, OpenMP, CUDA), defect chemistry, catalysis, phase transitions, thermoelectrics, topological insulators, and data-driven materials discovery. This is an excellent opportunity to share your work, discuss best practices in high-performance computing, and engage with peers on the latest advancements in the field.

Registration and abstract submission are open.

To learn more and register, visit the conference page here